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Uncalendered Aramid Paper X611 – X-Fiper

Uncalendered Aramid Paper X611 – X-Fiper | High-Porosity Electrical Insulation Paper

Uncalendered Aramid Paper X611 – X-Fiper is a high-performance electrical insulation material engineered for applications requiring excellent thermal resistance, strong dielectric properties, and superior resin absorption. Its uncalendered structure offers increased porosity, allowing deep impregnation with varnishes and resins for enhanced bonding and long-term insulation reliability.

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Aramid, also known as aromatic polyamide, is formed by the polymerization of m-benzoyl chloride and m-phenylenediamine. Aramid paper is made of meta-aramid fiber and fabric. It has good flame retardancy and temperature resistance performance, it can be used for more than 20 years at 220 °C. Aramid paper has inherent dielectric strength. The dielectric constant value of the product is close to air 1.0, which makes theelectric field distribution between aramid paper and cooling medium more uniform. Aramid paper serves as an advantageous replacement for Nomex paper due to its superior mechanical and thermal properties and competitive pricing with exceptional strength, heat resistance, and durability, Aramid Paper outperforms in challenging environments, providing enhanced reliability and longevity compared to Nomex Paper.

Pure Aramid is widely used in ground and wrapped insulation in dry transformer and rotating electrical equipment as slot, phase and end turn insulation; High temperature insulation protection such as battery separator and printed circuit board; As well as audio coil and other applications.

Aramid Paper
X-Fiper (UL Approved)
Insulation Class
‘H’ & ‘R’
Temperature Rang(°C)
180 – 220 °C
Color
Natural Off White
Thickness (mm)
5 to 23 mil ( 0.13 to 0.58 mm )
Surface
Smoothly non-Calendared
Width
10 mm to 1000 mm

X611 Specification

X611 is a soft, easily formable aramid paper (non-calendared). Available thickness: 5 to 23 mil (0.13 to 0.58 mm).

Porous structure
Loose fiber structure
Resin/varnish absorption
Dielectric stability
Thickness Mil / mm Basic weight (g/m²) Tensile (MD) Tensile (CD) Elongation (MD / CD) Dielectric (kV/mm)
55 mil / 0.13 mm361842 / 25
77 mil / 0.18 mm5730102 / 25
1010 mil / 0.25 mm7435152 / 25
1515 mil / 0.38 mm12456202 / 25
2323 mil / 0.58 mm19070402 / 25
Temperature Range180 – 220°C
Test MethodGB/T451.3
BrandX-Fiper
Thickness Range0.05 – 0.76 mm (2 to 30 mil)
Width10 mm to 1000 mm

Key Features

Excellent Electrical Insulation

Superior Thermal Resistance

High-performance Protection

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